DAGE4600W 全自动焊接推拉力测试机
产品型号：4600WDage
简介介绍：4600-W键合测试仪是一种台式系统，设计用于自动执行复杂的测试程序，无需操作员输入。该系统可以自动完成具有不同键方向的剪切和拉伸测试模式，同时在完成后记录故障模式图像
详情介绍
Load large batches of samples and benefit from robotic handling to load, align and transfer each device to the Bondtester.
Applications:
Automatic testing for leadframe and wafers (<200mm)
Paragon™ – Your automation partner
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Automation assisted GUI
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Build in check list & help
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Multi window views
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Schematic virtual images displayed
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Import maps or create your own
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Import wafer map file SINF / G85 / Klarf (AOI) / New Format
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Wire pull and ball shear pattern displays
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Colour gradients indicate different heights
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Inter-die wire corrections
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Map interface display
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Wire pull pattern
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Ball shear pattern
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Inter-die wire connections
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Remove uncertainty - camera assisted programming
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Ultimate accuracy using on-board cameras
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Both high resolution and field of view cameras as standard
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Fiducial images for alignment
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Automatic fiducial recognition
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On board camera live images during testing
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High resolution and FOV cameras
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Image every failure mode – even with extreme height variations
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Compound Surface Imaging (CSI) scans through a Z-stack to get every point in focus
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Automatically return to the failure site to record an image
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Assists with failure mode analysis
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Comes as standard with every 4600 Bondtester
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Compound surface imaging (CSI)
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Standard image
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专注为电子制造商提供如下SMT设备：
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锡膏印刷机、锡膏测厚仪SPI、SMT贴片机、HELLER回流焊、光学检测AOI、X-Ray X光射线检测机、等整条SMT生产线设备，以及服务和解决方案。
专注为封测厂提供如下半导体封测设备：
DieBond固晶机、DieAttach晶圆贴片机粘片机、WireBond焊线机引线键合机、Molding塑封机、WaferGrinding研磨机、WaferSaw切割机、X-RayDageX光检测机、BondTest推拉力测试机、Plasma等离子清洗机、C-SAM超声波扫描、原子力显微镜、先进封装电镀等设备
提供从IC Design→Fabless→封装测试→SMT表面组装的整套集成电路电子制造的行业资源，设备及解决方案
