Nordson Yestech SIP封装检测AOI
产品型号：M1m
简介介绍：Nordson Yestech 封装检测AOI应用于半导体封装检测，适合SIP产品检测
详情介绍
Nordson Yestech 封装检测AOI适合行业
•SMT Part Defects
•Die
Shift & Defects
•Lead Defects
•Bump Defects
•Bond Wires
•Paste
•Underfill
•Dispensed Materials
•Contamination
Nordson Yestech 封装检测AOI M1m检测SIP产品效果
